半导体、微电子专业英语单词(经典3篇)

半导体、微电子专业英语单词 篇一

In the field of semiconductor and microelectronics, there are numerous technical terms and vocabulary that are essential for understanding and working in this industry. These words not only describe the various components and processes involved in semiconductor technology but also help in communicating ideas and concepts effectively. In this article, we will explore some of the key English words used in the field of semiconductors and microelectronics.

1. Semiconductor: A material that has properties between those of a conductor and an insulator. It can conduct electricity under certain conditions.

2. Diode: A two-terminal electronic component that allows current to flow in one direction only.

3. Transistor: A three-terminal electronic device that amplifies or switches electronic signals and electrical power.

4. Integrated Circuit (IC): A miniaturized electronic circuit consisting of multiple interconnected semiconductor devices on a single semiconductor wafer.

5. Silicon: The most commonly used material for making semiconductor devices due to its abundance and ability to control electrical properties.

6. Wafer: A thin slice of semiconductor material, usually silicon, on which integrated circuits are fabricated.

7. Photolithography: The process of transferring a pattern from a mask or photomask onto a substrate using light-sensitive materials and etching techniques.

8. Etching: The process of removing material from a surface to create a desired pattern or structure.

9. Deposition: The process of depositing a material onto a surface, often using chemical reactions or physical vapor deposition techniques.

10. Doping: The process of intentionally adding impurities to a semiconductor material to modify its electrical properties.

11. FET (Field-Effect Transistor): A type of transistor that relies on an electric field to control the flow of current.

12. CMOS (Complementary Metal-Oxide-Semiconductor): A technology used in the fabrication of integrated circuits, which utilizes both n-type and p-type transistors.

13. VLSI (Very Large Scale Integration): The process of combining thousands or millions of transistors onto a single integrated circuit.

14. Die: A small piece of a semiconductor wafer containing a single integrated circuit.

15. Yield: The percentage of functional devices on a wafer or the number of good dies obtained from a wafer.

These are just a few examples of the many technical terms used in the field of semiconductors and microelectronics. Understanding and using these words correctly is crucial for anyone involved in this industry.

半导体、微电子专业英语单词 篇二

In the field of semiconductors and microelectronics, there are various processes and techniques used to fabricate integrated circuits and other electronic devices. In this article, we will explore some of the key English words related to these processes and techniques.

1. Lithography: The process of transferring a pattern from a mask or photomask onto a substrate using light-sensitive materials and etching techniques.

2. Etching: The process of removing material from a surface to create a desired pattern or structure.

3. Deposition: The process of depositing a material onto a surface, often using chemical reactions or physical vapor deposition techniques.

4. Oxidation: The process of forming a thin layer of oxide on a surface, often used to protect or isolate a material.

5. Diffusion: The process of spreading atoms or molecules from an area of high concentration to an area of low concentration.

6. Ion Implantation: The process of introducing dopant ions into a material to modify its electrical properties.

7. Annealing: The process of heating a material to a high temperature and then slowly cooling it, often used to relieve stress or repair defects.

8. Chemical Vapor Deposition (CVD): A technique used to deposit thin films of material onto a substrate by introducing reactive gases into a chamber.

9. Physical Vapor Deposition (PVD): A technique used to deposit thin films of material onto a substrate by evaporating or sputtering the material in a vacuum.

10. Wafer Bonding: The process of joining two semiconductor wafers together to create a structure with specific electrical or mechanical properties.

11. Planarization: The process of creating a flat or smooth surface on a semiconductor wafer, often using chemical-mechanical polishing techniques.

12. Backend Processing: The final stage of semiconductor fabrication, which involves assembling and testing the integrated circuits.

13. Yield: The percentage of functional devices on a wafer or the number of good dies obtained from a wafer.

14. Cleanroom: A controlled environment with low levels of dust and contaminants, used for semiconductor fabrication.

15. Metrology: The science and techniques used to measure and characterize semiconductor devices and materials.

These are just a few examples of the many processes and techniques used in the field of semiconductors and microelectronics. Familiarizing oneself with these words is essential for anyone involved in the fabrication and development of electronic devices.

半导体、微电子专业英语单词 篇三

半导体、微电子专业英语单词汇总

　　CBGA Ceramic Ball Grid Array 陶瓷焊球阵列

　　CCGA Ceramic Column Grid Array 陶瓷焊柱阵列

　　CLCC Ceramic Leaded Chip Carrier 带引脚的陶瓷片式载体

　　CML Current Mode Logic 电流开关逻辑

　　CMOS Complementary Metal-Oxide-Semiconductor 互补金属氧化物半导体

　　COB Chip on Board 板上芯片

　　COC Chip on Chip 叠层芯片

　　COG Chip on Glass 玻璃板上芯片

　　CSP Chip Size Package 芯片尺寸封装

　　CTE Coefficient of Thermal Expansion 热膨胀系数

　　CVD Chemical Vapor Depositon 化学汽相淀积

　　DCA Direct Chip Attach 芯片直接安装

　　DFP Dual Flat Package 双侧引脚扁平封装

　　DIP Double In-Line Package 双列直插式封装

　　DMS Direct Metallization System 直接金属化系统

　　DRAM Dynamic Random Access Memory 动态随机存取存贮器

　　DSO Dual Small Outline 双侧引脚小外形封装

　　DTCP Dual Tape Carrier Package 双载带封装

　　3D Three-Dimensional 三维

　　2D Two-Dimensional 二维

　　EB Electron Beam 电子束

　　ECL Emitter-Coupled Logic 射极耦合逻辑

　　FC Flip Chip 倒装片法

　　FCB Flip Chip Bonding 倒装焊

　　FCOB Flip Chip on Board 板上倒装片

　　FEM Finite Element Method 有限元法

　　FP Flat Package 扁平封装

　　FPBGA Fine Pitch Ball Grid Array 窄节距BGA

　　FPD Fine Pitch Device 窄节距器件

　　FPPQFP Fine Pitch Plastic QFP 窄节距塑料QFP

　　GQFP Guard-Ring Quad Flat Package 带保护环的QFP

　　HDI High Density Interconnect 高密度互连

　　HDMI High Density Multilayer Interconnect 高密度多层互连

　　HIC Hybird Integrated Circuit 混合集成电路

　　HTCC High Temperature Co-Fired Ceramic 高温共烧陶瓷

　　HTS High Temperature Storage 高温贮存

　　IC Integrated Circuit 集成电路

　　IGBT Insulated Gate Bipolar Transistor 绝缘栅双极晶体管

　　ILB Inner-Lead Bond 内引脚焊接

　　I/O Input/Output 输入/输出

　　IVH Inner Via Hole 内部通孔

　　JLCC J-Leaded Chip Carrier J形引脚片式载体

　　KGD Known Good Die 优质芯片

　　LCC Leadless Chip Carrier 无引脚片式载体

　　LCCC Leadless Ceramic Chip Carrier 无引脚陶瓷片式载体

　　LCCP Lead Chip Carrier Package 有引脚片式载体封装

　　LCD Liquid Crystal Display 液晶显示器

　　LCVD Laser Chemical Vapor Deposition 激光化学汽相淀积

　　LDI Laser Direct Imaging 激光直接成像

　　LGA Land Grid Array 焊区阵列

　　LSI Large Scale Integrated Circuit 大规模集成电路

　　LOC Lead Over Chip 芯片上引线健合

　　LQFP Low Profile QFP 薄形QFP

　　LTCC Low Temperature Co-Fired Ceramic 低温共烧陶瓷

　　MBGA Metal BGA 金属基板BGA

　　MCA Multiple Channel Access 多通道存取

　　MCM Multichip Module 多芯片组件

　　MCM-C MCM with Ceramic Substrate 陶瓷基板多芯片组件

　　MCM-D MCM with Deposited Thin Film Inteconnect Substrate 淀积薄膜互连基板多芯片组件

　　MCM-L MCM with Laminated Substrate 叠层基板多芯片组件

　　MCP Multichip Package 多芯片封装

　　MELF Metal Electrode Face Bonding 金属电极表面健合

　　MEMS Microelectro Mechanical System 微电子机械系统

　　MFP Mini Flat Package 微型扁平封装

　　MLC Multi-Layer Ceramic Package 多层陶瓷封装

　　MMIC Monolithic Microwave Integrated Circuit 微波单片集成电路

　　MOSFET Metal-Oxide-Silicon Field-Effect Transistor 金属氧化物半导体场效应晶体管

　　MPU Microprocessor Unit 微处理器

　　MQUAD Metal Quad 金属四列引脚

　　MSI Medium Scale Integration 中规模集成电路

　　OLB Outer Lead Bonding 外引脚焊接

　　PBGA Plastic BGA 塑封BGA

　　PC Personal Computer 个人计算机

　　PFP Plastic Flat Package 塑料扁平封装

　　PGA Pin Grid Array 针栅阵列

　　PI Polymide 聚酰亚胺

　　PIH Plug-In Hole 通孔插装

　　PTF Plastic Leaded Chip Carrier 塑料有引脚片式载体

　　PTF Polymer Thick Film 聚合物厚膜

　　PWB Printed Wiring Board 印刷电路板

　　PQFP Plastic QFP 塑料QFP

　　QFJ Quad Flat J-leaded Package 四边J形引脚扁平封装

　　QFP Quad Flat Package 四边引脚扁平封装

　　QIP Quad In-Line Package 四列直插式封装

　　RAM Random Access Memory 随机存取存贮器

　　SBB Stud-Bump Bonding 钉头凸点焊接

　　SBC Solder-Ball Connection 焊球连接

　　SCIM Single Chip Integrated Module 单芯片集成模块

　　SCM Single Chip Module 单芯片组件

　　SLIM Single Level Integrated Module 单级集成模块

　　SDIP Shrinkage Dual Inline Package 窄节距双列直插式封装

　　SEM Sweep Electron Microscope 电子扫描显微镜

　　SIP Single In-Line Package 单列直插式封装

　　SIP System In a Package 系统级封装

　　SMC Surface Mount Component 表面安装元件

　　SMD Surface Mount Device 表面安装器件

　　SMP Surface Mount Package 表面安装封装

　　SMT Surface Mount Technology 表面安装技术

　　SOC System On Chip 系统级芯片

　　SOIC Small Outline Integrated Circuit 小外形封装集成电路

　　SOJ Small Outline J-Lead Package 小外形J形引脚封装

　　SOP Small Outline Package 小外形封装

　　SOP System On a Package 系统级封装

　　SOT Small Outline Transistor 小外形晶体管

　　SSI Small Scale Integration 小规模集成电路

　　SSIP Small Outline Single-Line Plug Package 小外形单列直插式封装

　　SSOP Shrink Small Outline Package 窄节距小外形封装

　　SPLCC Shrinkage Plasitc Leadless Chip Carrier 窄节距塑料无引脚片式载体

　　STRAM Selftimed Random Access Memory 自定时随机存取存贮器

　　SVP Surface Vertical Package 立式表面安装型封装

　　TAB Tape Automated Bonding 载带自动焊

　　TBGA Tape BGA 载带BGA

　　TCM Thermal Conduc

　　TCP Tape Carrier Package 带式载体封装

　　THT Through-Hole Technology 通孔安装技术

　　TO Transistor Outline 晶体管外壳

　　TPQFP Thin Plastic QFP 薄形塑料QFP

　　TQFP Tape QFP 载带QFP

　　TSOP Thin SOP 薄形SOP

　　TTL Transistor-Transistor Logic 晶体管-晶体管逻辑

　　UBM Metalization Under Bump 凸点下金属化

　　UFPD Ultra Small Pitch Device 超窄节距器件

　　USOP Ultra SOP 超小SOP

　　USONF Ultra Small Outline Package Non Fin 无散热片的超小外形封装

　　UV Ultraviolet 紫外光

　　VHSIC Very High Speed Integrated Circuit 超高速集成电路

　　VLSI Very Large Scale Integrated Circuit 超大规模集成电路

　　WB Wire Bonding 引线健合

　　WLP Wafer Level Package 圆片级封装

　　WSI Wafer Scale Integration 圆片级规模集成